Our company is Yixing Wencheng Chemical Co., Ltd., a production plant of acrylate series including triethylene glycol dimethacrylate (TEGDMA). We have been engaged in the production and sales of acrylate series and their derivatives for more than 15 years. TEGDMA is a bifunctional methacrylate monomer synthesized by esterification of triethylene glycol and methacrylate. The molecule contains two ether bonds and two methacrylate double bonds at both ends. Compared with acrylate TEGDA, the methyl group brings steric hindrance effect, resulting in a slower curing rate, but significantly improved resistance to hydrolysis, heat aging, and damp heat. It also has low viscosity and combines flexibility with moderate hydrophilicity.
TEGDMA is a bifunctional methacrylate monomer. When exposed to UV light, the photoinitiator breaks down to generate free radicals. The methacrylate double bonds at both ends of the molecule participate in the free radical copolymerization of epoxy acrylic photosensitive resins to build a cross-linked film network. The long ether chain of the molecule provides flexibility, and the methyl side chain generates steric hindrance, which improves the hydrolytic stability of the ester bond. At the same time, it participates in the system as an active diluent to reduce viscosity, fully participates in curing, has no solvent evaporation, and avoids process defects such as pinholes and bubbles.
Electronic-grade TEGDMA is a low-viscosity bifunctional reactive monomer that can efficiently act as an active diluent in photosensitive ink systems, effectively reducing the overall viscosity of the resin and significantly improving screen printing and spraying processes, as well as the leveling effect on the board surface. It participates in the entire UV crosslinking and curing process and has no solvent evaporation, completely avoiding process defects such as clogging and pinholes caused by traditional solvents, and greatly optimizing the production coating process. The molecular structure contains long chains of triethylene glycol flexible ether, which can give the cured paint film excellent flexibility properties, perfectly adapting to the FPC flexible circuit board scenario. It can effectively resist repeated bending and eliminate the problem of paint film cracking. At the same time, it has good wetting and adhesion to PI film and copper foil substrates, which can significantly improve the defects of traditional inks that are brittle and easy to crack after curing. The monomer also features low volumetric shrinkage upon curing, effectively relieving internal stresses generated during thick-film curing and minimizing issues such as circuit edge retraction and film warping; this greatly enhances imaging precision for fine-line, narrow-pitch circuitry, meeting the demands of high-end precision PCB manufacturing. Relying on the steric hindrance effect of the methyl group at the molecular end, it can effectively protect the ester bond structure, giving the coating film excellent resistance to hydrolysis, damp heat, and long-term thermal aging. Under harsh conditions of high temperature and high humidity, it is not prone to chalking, cracking, or delamination failure. It is the core modified monomer for automotive-grade PCBs and high-reliability circuit inks, forming a differentiated reliability advantage.
Electronic-grade TEGDMA has significant limitations in formulation adaptability and is not suitable for use as a primary crosslinking monomer on its own. Its UV curing rate is slower than that of TMPTA. When used alone in LED-UV high-speed mass production lines, it is prone to problems such as insufficient exposure and sticky coating surface. It must be used in combination with TMPTA and TEGDA to balance the curing speed and crosslinking effect. Meanwhile, this monomer has a high hydrophilicity, and the amount added to the formulation must be strictly controlled within the range of 3%-8% for auxiliary modification. Excessive addition will significantly reduce the coating's resistance to chemical gold and strong alkalis, affecting the yield of subsequent PCB manufacturing processes. Furthermore, TEGDMA exhibits only moderate compatibility with certain polyurethane-modified photosensitive resin systems; to prevent issues such as delamination, loss of gloss, or performance instability during mass production, compatibility testing must be conducted and verified prior to implementation.
The use of ordinary industrial-grade TEGDMA is strictly prohibited for high-end PCB photosensitive inks. Industrial-grade products contain residual monoesters, moisture, aldehydes, and trace metal ions, and the impurity system cannot meet the stability and reliability requirements of high-precision electronic inks. Electronic high-purity TEGDMA must meet the following core indicators: purity ≥ 99.2%, moisture ≤ 0.03%, and color ≤ 15–20 APHA. At the same time, it strictly controls harmful impurities such as metal ions, aldehydes, and monoesters. The content of MEHQ polymerization inhibitor is precisely controllable to ensure batch consistency. Various impurities can directly cause defects in inks and end-product PCBs: moisture and monoester impurities cause batch drift in ink photosensitivity; trace metal ions can easily induce PCB ion migration and leakage risks; aldehyde impurities cause ink discoloration and storage thickening gel; excessively high acid values can corrode copper foil and damage the storage viscosity stability of inks, seriously affecting mass production yield and product shelf life. Yixing Wencheng Chemical Co., Ltd. is a high-quality manufacturer of TEGDMA. Its electronic-grade TEGDMA has been widely used in various industries such as electronic photosensitive inks.
Electronic-grade TEGDMA is a differentiated core modified monomer for high-end PCB photosensitive inks. When used in combination with the main crosslinking monomer TMPTA, it can significantly improve the film's resistance to damp heat, hydrolysis, and aging, on top of the existing high crosslinking strength and rapid curing. This helps ink companies develop specialized inks for automotive-grade FPCs and high-reliability flexible circuit boards, creating product performance barriers, securing high-value-added orders, and effectively escaping the homogeneous price competition in the low-end market. In terms of quality and after-sales service, high-purity electronic-grade TEGDMA has controllable impurities and excellent batch stability, which can significantly reduce customer complaints about poor reliability of downstream PCB end products such as paint film cracking and peeling under high temperature and humidity and long-term aging conditions, and significantly improve the reputation of end users and the stability of product delivery. In terms of market positioning, TEGDMA and TMPTA complement each other rather than replace each other: AI servers and new energy rigid board inks mainly rely on trifunctional TMPTA to achieve high hardness, high thermal shock resistance and high-speed curing; while the automotive-grade, high humidity and heat resistance FPC flexible board field is the core growth track of TEGDMA. With the market gap for low-metal-ion, high-purity electronic-grade TEGDMA continuing to widen, it possesses extremely strong commercial application prospects and procurement value.
Our company's triethylene glycol dimethacrylate (TEGDMA) has been widely and long-term used in the production of PCB inks. Our TEGDMA products are known for their stable performance, excellent quality, and consistent supply. They are exported to many countries worldwide. With 15 years of experience in the industry, we have always adhered to quality and stable production capacity. We sincerely welcome customers from all walks of life to inquire, discuss, and cooperate with us!
