Our company is Yixing Wencheng Chemical Co., Ltd., a production plant of acrylate series including polyethylene glycol diacrylate (PEGDA). We have been engaged in the production and sales of acrylate series and their derivatives for more than 15 years. PEGDA is a difunctional acrylate reactive monomer featuring acrylic double bonds at both ends of the molecule and a flexible polyethylene glycol backbone rich in ether linkages. During the UV exposure curing process of electronic ink, the photoinitiator is excited and decomposed by ultraviolet light to generate free radicals, which promote the free radical copolymerization reaction of the acrylic double bonds at both ends of PEGDA with photosensitive resins such as epoxy acrylic acid and polyurethane acrylic acid. It can be effectively integrated into the ink curing system and participate in the construction of a dense three-dimensional cross-linked network, while the ether bonds in the molecular chain segments are completely preserved inside the paint film. Functioning also as a reactive diluent, PEGDA’s double bonds participate fully in the curing and film-forming process, resulting in zero VOC emissions. It effectively adjusts ink viscosity and introduces flexible segments into the film, thereby balancing the high rigidity and brittleness often associated with the curing of high-functionality monomers. Common specifications—categorized by molecular weight—include PEG200DA, PEG400DA, and PEG600DA. Lower molecular weights (shorter molecular segments) result in higher cross-linking density and superior film hardness; conversely, higher molecular weights (longer polyethylene glycol ether chains) enhance the film's flexibility and hydrophilicity while reducing cross-linking density.
With its unique long ether bond molecular structure, PEGDA has multiple advantages in formulation applications, and can effectively improve the flexibility of the coating film, reduce curing shrinkage and internal stress. Its chain segments have excellent internal rotation characteristics, which can offset the brittleness of the coating film caused by high-functional monomers such as TMPTA and Di-TMPTA, reduce curing volume shrinkage and internal stress of thick film curing, and eliminate problems such as line shrinkage and board warping. It is compatible with FPC flexible circuit board inks and various thin substrate UV ink systems. The polar ether bonds in the molecular chain can significantly improve the substrate wetting ability of the ink system, improve the wetting and spreading effect of the ink on the surface of copper foil, PI film, PET and FR4 substrate, reduce coating defects such as pinholes and craters, and effectively improve the adhesion of the cured paint film to various substrates. Among them, the low molecular weight grade PEG200DA has excellent dilution performance, which can effectively reduce the viscosity of photosensitive resin system and improve the leveling of processes such as screen printing, spraying, and roller coating. It does not require the addition of non-reactive solvents, thus avoiding the potential electronic reliability risks caused by solvent residues from the source. Furthermore, compared to some small-molecule difunctional monomers, this product features lower odor and reduced skin irritation, thereby improving the production line working environment. It also demonstrates good compatibility with various photosensitive resins, offering ample formulation flexibility suitable for industrial-scale production. In addition, the molecule has its own hydrophilic ether bond, which can be used in water-dispersible electronic ink systems to effectively maintain the dispersion stability of the system.
PEGDA has significant comprehensive application value in electronic ink formulations. As a high-quality flexible modifier monomer, it can be compounded with high-functionality monomers such as Di-TMPTA and TMPTA to achieve a balance between high heat and chemical resistance and flexible crack resistance of the coating film. It can be used to develop electronic inks for flexible PCBs and thin substrates, enrich the product matrix of enterprises, and effectively avoid the homogeneous low-price competition of ordinary solder resist inks. At the same time, it can effectively reduce ink curing shrinkage and internal stress, significantly reduce process defects such as board warping, paint film cracking, and poor adhesion, reduce the probability of rework of end PCB products and customer complaint risks, and improve mass production yield. In addition, PEGDA is a fully reactive active monomer that participates in cross-linking and film formation during the curing process with no VOC volatilization, which can fully meet the stringent low-VOC environmental control requirements of the electronics industry.
PEGDA has a clear application scenario and market positioning in the field of electronic inks. This product is an auxiliary modified flexible monomer and cannot be used as a main crosslinking monomer. It forms a complementary and compounded relationship with Di-TMPTA and TMPTA. Due to its specific properties, it is unsuitable for large-scale use in standard high-reliability solder mask applications—such as those for high-performance computing (HPC) substrates or automotive power PCBs. The core demand for our products is mainly concentrated in the fields of flexible printed circuit boards (FPCs), thin substrate protective inks, flexible marking and character inks, and some photo-imaging flexible coatings. As market demand for FPCs and circuitry for flexible displays continues to grow, the flexible electronic ink industry is expanding, driving a steady rise in demand for high-purity, low-metal-ion PEGDA. Conversely, standard industrial-grade PEGDA contains excessive impurities that fail to meet the reliability standards required for electronic inks; consequently, manufacturers prioritize sourcing high-quality, electronic-grade PEGDA.
The production of electronic inks must strictly use high-purity electronic-grade PEGDA; ordinary industrial-grade products cannot be used. Industrial-grade PEGDA contains impurities such as mono-acrylates, oligomers, moisture, peroxides, aldehydes, and trace metal ions. These impurities can easily cause fluctuations in photosensitivity, yellowing during storage, and ion migration, thereby failing to meet the high reliability standards required for electronic ink production. The core quality control standards for electronic-grade PEGDA are as follows: effective monomer purity ≥98.5%, moisture content ≤0.05%, and color ≤20 APHA. Additionally, the content of the MEHQ polymerization inhibitor must be precisely controlled, and levels of metal ions (such as copper, iron, sodium, and potassium) as well as impurities like peroxides and aldehydes must be strictly regulated. The risks associated with these impurities are well-defined: metal ions can induce ion migration in PCBs under long-term hot and humid conditions, leading to failures such as current leakage and short circuits; moisture and mono-ester impurities can cause batch-to-batch photosensitivity drift and instability in the exposure window; peroxide and aldehyde impurities can lead to increased viscosity, yellowing, or even premature gelation during storage; and excessive color impurities can result in dull coloration of legend inks, directly impairing circuit identification. Yixing Wencheng Chemical Co., Ltd. is a premium manufacturer of PEGDA, and its products are widely used across various industries, including the electronic ink sector.
When PEGDA is used in the mass production of inks, it is necessary to control the amount added, select the appropriate grade, and formulate a reasonable compound. The standard addition range is 5-15%; for high water resistance and high reliability rigid board solder resist, the addition should be controlled within 5%, or even less or no. For FPC flexible ink, the addition can be increased to 8-15%, but excessive addition is strictly prohibited. Adding too much will significantly increase the water absorption rate of the paint film, resulting in a significant decrease in resistance to boiling water, MEK, damp heat, and alkali, and it will also make it prone to blistering during reflow soldering. In terms of grade selection, PEG200DA has lower viscosity and higher crosslinking density, balancing toughness and basic chemical resistance; PEG400DA/600DA is more flexible, but has higher hydrophilicity and reduced resistance to damp heat, and is only used for flexible inks with less stringent water resistance requirements. In terms of formulation, the flexible FPC ink uses epoxy acrylic resin + TMPTA (main crosslinking) + PEGDA (5-12%) + TEGDA to assist in toughening; the water-based flexible electronic ink uses PEG400DA to improve dispersion stability. The use of PEGDA in large proportions in solder resist formulations for high-reliability rigid boards such as AI computing power carrier boards and automotive power PCBs is strictly prohibited.
Our company's polyethylene glycol diacrylate (PEGDA) has been widely and long-term used in the production of PCB inks. Our PEGDA products are stable in performance and of excellent quality, with a consistent supply and are exported to many countries around the world. Having been deeply involved in the industry for fifteen years, we always adhere to quality and stable production capacity. We sincerely welcome customers from all walks of life to consult, negotiate, and cooperate with us!
