Acrylate series
Triethylene glycol diacrylate (TEGDA) is a commonly used bifunctional acrylate monomer with moderate flexibility, low viscosity and good photocuring properties. It is widely used in formulation systems such as UV-curing coatings, inks, adhesives, and 3D printing materials.
1680-21-3
mixture
TEGDA
1. Coatings: Highly wear-resistant UV coatings for wood, metal or plastic surfaces, such as furniture coatings and protective layers for automotive parts.
2. Inks: UV-curable inks for the printing industry, such as packaging printing and label printing, to improve drying speed and scratch resistance.
3. Adhesives: Electronic component encapsulation adhesives, optical adhesives (such as mobile phone screen lamination adhesives), pressure-sensitive adhesives, structural adhesives, with fast curing and high bonding strength.
4. Dental materials
Composite resins: Dental resins and filling materials for tooth restorations, providing high hardness and wear resistance.
Adhesives: Dental orthodontic adhesives to ensure a firm bond between brackets and teeth.
5. 3D printing materials SLA printing resins, DLP printing resins, 3D printing photosensitive resins
6. Photocurable resins (SLA/DLP): Used to make high-precision models, medical device prototypes or jewelry castings, to enhance the mechanical strength and heat resistance of printed parts.
7. Photoresists: Graphical processes in microelectronics manufacturing, such as the processing of integrated circuits or flexible circuit boards.
8. Electronic packaging materials: LED encapsulation glue, protective coating for LED packaging or semiconductor devices, improving moisture resistance and insulation.
9. Medical polymer materials: surface treatment of biocompatible catheter coatings or degradable stents, which must undergo strict biosafety verification.
10. Optical materials: used to adjust the refractive index of lenses or optical fiber coatings.
11. Elastomer modification: as a cross-linking agent for rubber or plastics, improving chemical resistance or high temperature resistance.